Power Electronic Packaging
Design, Assembly Process, Reliability and Modeling
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, co…
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Produktdetails
- ISBN: 978-1-4899-8797-6
- EAN: 9781489987976
- Produktnummer: 16272048
- Verlag: Springer New York
- Sprache: Englisch
- Erscheinungsjahr: 2014
- Seitenangabe: 612 S.
- Masse: H23.5 cm x B15.5 cm x D3.2 cm 914 g
- Auflage: 2012
- Abbildungen: Paperback
- Gewicht: 914
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