Influence of Temperature on Microelectronics and System Reliability
A Physics of Failure Approach
This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs.The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-c…
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Produktdetails
Weitere Autoren: Pecht, Michael G. / Hakim, Edward B.
- ISBN: 978-0-429-61111-7
- EAN: 9780429611117
- Produktnummer: 34393080
- Verlag: Taylor & Francis Ltd.
- Sprache: Englisch
- Erscheinungsjahr: 2020
- Seitenangabe: 336 S.
- Plattform: PDF
- Masse: 104'393 KB
Über den Autor
Pradeep Lall, Michael G. Pecht, Edward B. Hakim
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