Wafer-Level Chip-Scale Packaging
Analog and Power Semiconductor Applications
This book presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability, and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials, and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Along with new analog and power WLCSP development, the role of…
Mehr
CHF 192.00
Preise inkl. MwSt. und Versandkosten (Portofrei ab CHF 40.00)
V301:
Libri-Titel folgt in ca. 2 Arbeitstagen
Produktdetails
Weitere Autoren: Liu, Yong
- ISBN: 978-1-4939-1555-2
- EAN: 9781493915552
- Produktnummer: 16512668
- Verlag: Springer-Verlag GmbH
- Sprache: Englisch
- Erscheinungsjahr: 2014
- Seitenangabe: 322 S.
- Masse: H24.1 cm x B16.0 cm x D2.4 cm 676 g
- Abbildungen: Book; 58 schwarz-weiße und 250 farbige Abbildungen, 58 schwarz-weiße Tabellen, Bibliographie
- Gewicht: 676
2 weitere Werke von Shichun Qu:
Bewertungen
Anmelden