Packaging of High Power Semiconductor Lasers
This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.
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Produktdetails
Weitere Autoren: Liu, Xingsheng / Xiong, Lingling / Zhao, Wei
- ISBN: 978-1-4614-9263-4
- EAN: 9781461492634
- Produktnummer: 18254658
- Verlag: Springer
- Sprache: Englisch
- Erscheinungsjahr: 2014
- Plattform: PDF
- Masse: 23'584 KB
Über den Autor
Dr. Xingsheng Liu, Dr. Wei Zhao, Dr. Lingling Xiong, and Dr. Hui Liu are at the Xi'an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences.
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