Harsh Environment Electronics

Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacturing of high-temperature interconnect materials, with a particular focus on the complexities introduced by harsh conditions. It also discusses the techniques to cope with the impact of extreme temperatures when implementing manufacturing processes at an industrial scale. Furthermore, the book examines the application of nanomaterials, current trends within the topical area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics Reviews all relevant materials used in interconnect technology as well as alternative approaches Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications Covers wide-bandgap semiconductor device technologies for high-temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.