Microscale Heat Conduction in Integrated Circuits and Their Constituent Films
Advances in the semiconductor technology have enabled steady, exponential im provement in the performance of integrated circuits. Miniaturization allows the integration of a larger number of transistors with enhanced switching speed. Novel transistor structures and passivation materials diminish circuit delay by minimizing parasitic electrical capacitance. These advances, however, pose several challenges for the thermal engineering of integrated circuits. The low thermal conductivities of passivation layers result in large temperature rises and temperature gradient magni tudes, which degrade electrical characteristics of transistors and red…
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Produktdetails
Weitere Autoren: Sungtaek Ju, Y.
- ISBN: 978-0-7923-8591-2
- EAN: 9780792385912
- Produktnummer: 2956169
- Verlag: Springer Us
- Sprache: Englisch
- Erscheinungsjahr: 1999
- Seitenangabe: 132 S.
- Masse: H24.1 cm x B16.0 cm x D1.2 cm 371 g
- Auflage: 1999
- Abbildungen: HC runder Rücken kaschiert
- Gewicht: 371
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