Fundamentals of Lead-Free Solder Interconnect Technology
From Microstructures to Reliability
This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution. The continuing miniaturization…
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Produktdetails
Weitere Autoren: Kim, Choong-Un / Lee, Tae-Kyu / Ma, Hongtao
- ISBN: 978-1-4614-9265-8
- EAN: 9781461492658
- Produktnummer: 15272288
- Verlag: Springer Us
- Sprache: Englisch
- Erscheinungsjahr: 2014
- Seitenangabe: 268 S.
- Masse: H24.1 cm x B16.0 cm x D2.0 cm 571 g
- Auflage: 2015
- Abbildungen: HC runder Rücken kaschiert
- Gewicht: 571
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