Tae-Kyu Lee

Fundamentals of Lead-Free Solder Interconnect Technology

From Microstructures to Reliability

Buch

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

CHF 150.00

Preise inkl. MwSt. und Versandkosten (Portofrei ab CHF 40.00)

Versandfertig innerhalb 1-3 Werktagen

V105: Folgt in ca. 15 Arbeitstagen

Produktdetails

Weitere Autoren: Bieler, Thomas R. / Kim, Choong-Un / Ma, Hongtao

ISBN: 978-1-4899-7801-1
EAN: 9781489978011
Produktnummer: 21126887
Verlag: Springer-Verlag New York Inc.
Sprache: Englisch
Erscheinungsjahr: 2016
Seitenangabe: 253 S.
Masse: 559 g
Auflage: Softcover reprint of the original 1st ed. 2015
Abbildungen: 18 Tables, black and white; 81 Illustrations, color; 70 Illustrations, black and white; XIII, 253 p. 151 illus., 81 illus. in color.
Gewicht: 559