Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses
Fundamental Mechanisms and Application to IC Interconnect Technology
As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant chal…
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Produktdetails
Weitere Autoren: Gill, William N. / Gutmann, Ronald J.
- ISBN: 978-1-4020-7193-5
- EAN: 9781402071935
- Produktnummer: 1814686
- Verlag: Springer Us
- Sprache: Englisch
- Erscheinungsjahr: 2002
- Seitenangabe: 252 S.
- Masse: H24.1 cm x B16.0 cm x D1.8 cm 547 g
- Auflage: 2002
- Abbildungen: HC runder Rücken kaschiert
- Gewicht: 547
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