Produktbild
Er-Ping Li

Electrical Modeling and Design for 3D System Integration

3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

Buch

New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systemsBased on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computat… Mehr

CHF 170.00

Preise inkl. MwSt. und Versandkosten (Portofrei ab CHF 40.00)

Versandfertig innerhalb 1-3 Werktagen

Produktdetails


  • ISBN: 978-0-470-62346-6
  • EAN: 9780470623466
  • Produktnummer: 10963060
  • Verlag: Wiley
  • Sprache: Englisch
  • Erscheinungsjahr: 2012
  • Seitenangabe: 384 S.
  • Masse: H24.0 cm x B15.8 cm x D3.1 cm 778 g
  • Gewicht: 778

Über den Autor


ER-PING LI, PhD, holds an appointment as Chair Professor at Zhejiang University, China, and has also been a principal scientist and director at the Institute of High Performance Computing, Singapore. He is a Fellow of the IEEE and a Fellow of the Electromagnetics Academy. He has received numerous awards and honors in recognition of his professional work from the IEEE and other professional bodies. Dr. Li is a pioneer in the modeling and simulation for signal/power and EMC in integrated circuits and electronic systems packaging. He has chaired or spoken at numerous international conferences and universities, and has also served as editor to several IEEE Transactions.

5 weitere Werke von Er-Ping Li:


Bewertungen


0 von 0 Bewertungen

Geben Sie eine Bewertung ab!

Teilen Sie Ihre Erfahrungen mit dem Produkt mit anderen Kunden.