Electroless Copper and Nickel-Phosphorus Plating: Processing, Characterisation and Modelling
Compared with electroplating, electroless plating allows uniform deposits over different surfaces. Electroless copper and nickel-phosphorus deposits provide protective and functional coatings in industries as diverse as electronics, automotive, aerospace and chemical engineering. Written by leading experts in the field, this important book reviews the deposition process and the key properties of electroless copper and nickel-phosphorus deposits as well as their practical applications.
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Produktdetails
Weitere Autoren: Wu, Xiaomin / Keong, K. G.
- ISBN: 978-1-84569-808-9
- EAN: 9781845698089
- Produktnummer: 9707615
- Verlag: Woodhead Pub
- Sprache: Englisch
- Erscheinungsjahr: 2011
- Seitenangabe: 304 S.
- Masse: H24.5 cm x B15.8 cm x D2.7 cm 621 g
- Auflage: New
- Gewicht: 621
Über den Autor
Professor Wei Sha is Professor of Materials Science at The Queen's University of Belfast, UK Dr. Kim Ghee Keong currently resides in Malaysia. All three authors are internationally renowned for their research and work in the electroless field.
4 weitere Werke von W. Sha:
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