Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the mo…
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Produktdetails
- ISBN: 978-1-315-30585-1
- EAN: 9781315305851
- Produktnummer: 24244666
- Verlag: Taylor & Francis Ltd.
- Sprache: Englisch
- Erscheinungsjahr: 2017
- Seitenangabe: 340 S.
- Plattform: EPUB
- Masse: 8'889 KB
- Abbildungen: 261 schwarz-weiße Abbildungen, 123 schwarz-weiße Fotos, 138 schwarz-weiße Zeichnungen, 10 schwarz-weiße Tabellen
Über den Autor
Xing-Chang Wei received the Ph. D degree in electrical engineering from the Xi'an University of Electronic Science and Technology, China, in 2001. From 2001 to 2010, he was with the A*STAR Institute of High Performance Computing, Singapore, as a Research Fellow, Senior Research Engineer, and then Research Scientist. He received the 2007 Singapore Institute of Engineers Prestigious Engineering Achievement Award for his contribution to the development of a novel electromagnetic compatibility (EMC) measurement facility. In 2010, he joined Zhejiang University, Hangzhou, China, as a Full Professor, and received the New Century Excellent Talents Award from China's Ministry of Education.His main research interests include power integrity and signal integrity simulation and design for high-speed printed circuit boards, through interposer vias analysis, and the development of fast algorithms for computational electromagnetics. He has more than 10 years research experience in the EMC modeling and design of high-speed printed circuit boards and packaging. He has authored/co-authored more than 50 papers published in IEEE Transactions and IEEE international conferences in this area.
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