Advanced Interconnects for ULSI Technology
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance.Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and app…
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Produktdetails
Weitere Autoren: Ho, Paul S. (Hrsg.) / Zschech, Ehrenfried (Hrsg.)
- ISBN: 978-0-470-66254-0
- EAN: 9780470662540
- Produktnummer: 12033613
- Verlag: Paperbackshop Uk Import
- Sprache: Englisch
- Erscheinungsjahr: 2012
- Seitenangabe: 579 S.
- Masse: H26.1 cm x B17.7 cm x D3.3 cm 1'069 g
- Gewicht: 1069
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