Three-Dimensional Integrated Circuit Design
With vastly increased complexity and functionality in the nanometer era (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. This is due primarily to the inevitable increase in the distance among circuit elements and interconnect design solutions have become the greatest determining factor in overall performance. Three-dimensional (3D) integrated circuits (ICs), which contain multiple layers of active devices, have the potential to enhance dramatically chip performance and functionality, while reducing the distance among devices on a chip. They promise solutio…
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Produktdetails
Weitere Autoren: Friedman, Eby G.
- ISBN: 978-0-12-374343-5
- EAN: 9780123743435
- Produktnummer: 3730486
- Verlag: Morgan Kaufmann Publ Inc
- Sprache: Englisch
- Erscheinungsjahr: 2008
- Seitenangabe: 336 S.
- Masse: H24.3 cm x B19.7 cm x D2.5 cm 852 g
- Auflage: New
- Gewicht: 852
Über den Autor
Vasilis F. Pavlidis received the B.S. and M.Eng. in electrical and computer engineering from the Democritus University of Thrace, Xanthi, Greece, in 2000 and 2002, respectively. He received the M.Sc. and Ph.D. degrees from, University of Rochester, Rochester, NY in 2003 and 2008, respectively. From 2000 to 2002, he was with INTRACOM S.A., Athens, Greece. In summer of 2007, he was with Synopsys Inc., Mountain View, California. His current research interests are in the area of interconnect modeling, 3-D integration, networks-on-chip, and related design issues in VLSI. Eby G. Friedman received the B.S. degree from Lafayette College in 1979, and the M.S. and Ph.D. degrees from the University of California, Irvine, in 1981 and 1989, respectively, all in electrical engineering. From 1979 to 1991, he was with Hughes Aircraft Company, rising to the position of manager of the Signal Processing Design and Test Department, responsible for the design and test of high performance digital and analog IC's. He has been with the Department of Electrical and Computer Engineering at the University of Rochester since 1991, where he is a Distinguished Professor, the Director of the High Performance VLSI/IC Design and Analysis Laboratory, and the Director of the Center for Electronic Imaging Systems. He is also a Visiting Professor at the Technion - Israel Institute of Technology. His current research and teaching interests are in high performance synchronous digital and mixed-signal microelectronic design and analysis with application to high speed portable processors and low power wireless communications. He is the author of more than 300 papers and book chapters, several patents, and the author or editor of ten books in the fields of high speed and low power CMOS design techniques, high speed interconnect, and the theory and application of synchronous clock and power distribution networks. He was the Editor-in-Chief of the IEEE Transactions on Very Large Scale Integration (VLSI) Systems, a Member of the editorial board of the Proceedings of the IEEE and a recipient of the University of Rochester Graduate Teaching Award, and a College of Engineering Teaching Excellence Award. Dr. Friedman is a Senior Fulbright Fellow and an IEEE Fellow.
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