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Rohit (Hrsg.) Sharma

Design of 3D Integrated Circuits and Systems

Ebook (EPUB Format)

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D system… Mehr

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Produktdetails


  • ISBN: 978-1-351-83159-8
  • EAN: 9781351831598
  • Produktnummer: 29290437
  • Verlag: Taylor & Francis Ltd.
  • Sprache: Englisch
  • Erscheinungsjahr: 2018
  • Seitenangabe: 324 S.
  • Plattform: EPUB
  • Masse: 8'451 KB
  • Abbildungen: 125 schwarz-weiße Abbildungen

Über den Autor


Rohit Sharma is faculty at the Indian Institute of Technology Ropar, Punjab. He previously worked as a post-doctoral researcher at Seoul National University, South Korea and at Georgia Institute of Technology, Atlanta, USA. Dr. Sharma has authored/co-authored over 50 journal and conference publications, one book, one book chapter, two patents/copyrights, and several invited talks. He was a recipient of the Brain Korea Research Fellowship (2010), the Indo-US Research Fellowship (2011), and Best Paper Awards in ASQED 2010 and GIT 2011 conferences. An IEEE and ACM member, he has served as a journal referee and committee member/session co-chair on multiple occasions.

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