Copper Wire Bonding
This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes-bond force, electr…
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Produktdetails
Weitere Autoren: Choubey, Anupam / Pecht, Michael G / Zhong, Zhaowei
- ISBN: 978-1-4614-5760-2
- EAN: 9781461457602
- Produktnummer: 14727762
- Verlag: Springer New York
- Sprache: Englisch
- Erscheinungsjahr: 2013
- Seitenangabe: 264 S.
- Masse: H24.4 cm x B16.4 cm x D2.3 cm 536 g
- Auflage: 2014
- Abbildungen: HC gerader Rücken kaschiert
- Gewicht: 536
Über den Autor
Preeti Chauhan is a researcher from the Center for Advanced Life Cycle Engineering at the University of Maryland. She is currently a technology development Q&R engineer at Intel Corporation.Anupam Choubey is a consultant in the area of packaging engineering in the Boston, MA area. ZhaoWei Zhong is a Professor of Mechanical and Aerospace Engineering at Nanyang Technological University.Michael Pecht is a world renowned reliability engineer and educator. He is the founder and Director of CALCE (Center for Advanced Life Cycle Engineering) at the University of Maryland.
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