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Tsunenobu Kimoto

Fundamentals of Silicon Carbide Technology

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A comprehensive introduction and up-to-date reference to SiC power semiconductor devices covering topics from material properties to applicationsBased on a number of breakthroughs in SiC material science and fabrication technology in the 1980s and 1990s, the first SiC Schottky barrier diodes (SBDs) were released as commercial products in 2001. The SiC SBD market has grown significantly since that time, and SBDs are now used in a variety of power systems, particularly switch-mode power supplies and motor controls. SiC power MOSFETs entered commercial production in 2011, providing rugged, high-efficiency switches for high-frequency power system… Mehr

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Produktdetails


  • ISBN: 978-1-118-31352-7
  • EAN: 9781118313527
  • Produktnummer: 19161060
  • Verlag: Wiley-IEEE Press
  • Sprache: Englisch
  • Erscheinungsjahr: 2018
  • Seitenangabe: 554 S.
  • Masse: H26.0 cm x B18.3 cm x D3.4 cm 1'226 g
  • Abbildungen: HC gerader Rücken kaschiert
  • Gewicht: 1226

Über den Autor


Tsunenobu Kimoto, Department of Electronic Science and Engineering, Kyoto University, Japan.Professor Kimoto has been involved in SiC research for more than 20 years and his research activity in this field covers growth, optical and electrical characterization, device processing, device design and fabrication. He has published more than 300 papers in international journals and has presented more than 50 invited talks at international conferences. He was a guest editor of the 2008 SiC special issues of IEEE Transactions on Electron Devices.James A Cooper, School of Electrical and Computer Engineering, Purdue University, Indiana, USAProfessor Cooper was a member of technical staff at Bell Laboratories for ten years where he was principal designer of AT&T's first microprocessor and investigated nonlinear transport in silicon inversion layers. His research at Purdue has centered on semiconductor device physics and characterization, focusing primarily on III-V materials and silicon carbide. He has co-authored over 250 technical papers and conference presentations.

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