Advanced Interconnects for ULSI Technology
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and ap…
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Produktdetails
Weitere Autoren: Ho, Paul S. (Hrsg.) / Baklanov, Mikhail (Hrsg.)
- ISBN: 978-1-119-96324-0
- EAN: 9781119963240
- Produktnummer: 13812888
- Verlag: Wiley
- Sprache: Englisch
- Erscheinungsjahr: 2012
- Seitenangabe: 624 S.
- Plattform: PDF
- Masse: 53'326 KB
- Auflage: 2. Aufl.
Über den Autor
Mikhail R. BaklanovIMEC, Leuven, BelgiumPaul S. HoLaboratory for Interconnect and Packaging, University of Texas at Austin, Austin, Texas, USAEhrenfried ZschechFraunhofer Institute for Nondestructive Testing, Dresden, Germany
10 weitere Werke von Ehrenfried (Hrsg.) Zschech:
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