Advances in 3D Integrated Circuits and Systems
3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the man…
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Produktdetails
Weitere Autoren: Tan, Chuan-Seng
- ISBN: 978-981-46990-0-6
- EAN: 9789814699006
- Produktnummer: 18811890
- Verlag: Wspc
- Sprache: Englisch
- Erscheinungsjahr: 2015
- Seitenangabe: 392 S.
- Masse: H23.5 cm x B15.7 cm x D2.5 cm 719 g
- Abbildungen: HC gerader Rücken kaschiert
- Gewicht: 719
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