Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
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Produktdetails
Weitere Autoren: Noia, Brandon
- ISBN: 978-3-319-02377-9
- EAN: 9783319023779
- Produktnummer: 15665142
- Verlag: Springer International Publishing
- Sprache: Englisch
- Erscheinungsjahr: 2013
- Seitenangabe: 264 S.
- Masse: H24.4 cm x B15.9 cm x D2.2 cm 537 g
- Auflage: 2014
- Abbildungen: HC runder Rücken kaschiert
- Gewicht: 537
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