Three Dimensional System Integration
IC Stacking Process and Design
Three Dimensional System Integration: IC Stacking From Process Technology to System DesignEdited by: Antonis PapanikolaouDimitrios SoudrisRiko Radojcic Three-dimensional (3D) integrated circuit (IC) stacking enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology less than 10-15 years from its original c…
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Produktdetails
Weitere Autoren: Soudris, Dimitrios (Hrsg.) / Radojcic, Riko (Hrsg.)
- ISBN: 978-1-4419-0962-6
- EAN: 9781441909626
- Produktnummer: 16812000
- Verlag: Springer-Verlag GmbH
- Sprache: Englisch
- Erscheinungsjahr: 2010
- Seitenangabe: 246 S.
- Plattform: PDF
- Masse: 15'510 KB
- Auflage: 2011
2 weitere Werke von Antonis (Hrsg.) Papanikolaou:
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