Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging
This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.
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Produktdetails
Weitere Autoren: Lee, Jong Hoon / Tentzeris, Manos M.
- ISBN: 978-1-59829-244-2
- EAN: 9781598292442
- Produktnummer: 4237111
- Verlag: Morgan & Claypool
- Sprache: Englisch
- Erscheinungsjahr: 1905
- Seitenangabe: 108 S.
- Masse: H23.5 cm x B19.1 cm x D0.6 cm 233 g
- Auflage: New
- Gewicht: 233
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