The Electronic Packaging Handbook

The packaging of electronic systems and devices represents a serious challenge for designers and managers. A major new entry in the Electrical Engineering series, The Electronic Packaging Handbook provides essential information on the design and packaging of electronic devices and systems. The book is valuable to engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products. Topics covered include design automation, new IC packaging technologies, materials, testing, and safety issues. TOC:Fundamentals of the Design Process.- Electronic Design Automation.- Design for Test.- Substrates.- Grounding and Ground Plane Techniques for Circuit Assemblies.- Part Technologies.- Connector Technologies, On and Off Board.- Optical Connections.- Thermal Issues and Management.- Surface Mount Manufacturing Technologies.- Ceramic Assemblies.- Chip On Board Assemblies.- Inspection of Assemblies.- Testing of Assemblies.- Design for Test.- Special Circuit Consideration, High Speed Digital Circuits.- Special Circuit Considerations, RF Circuits.- Special Circuit Consideration, I/O Circuits.- Special Circuit Considerations, Low-Level Analog Circuits.- Package Considerations.- Safety and Third-Party Inspection Issues.- CEE Testing.