TSV 3D RF Integration
High Resistivity Si Interposer Technology
TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S paramete…
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Produktdetails
Weitere Autoren: Jin, Yufeng (Professor, Peking University, China)
- ISBN: 978-0-323-99602-0
- EAN: 9780323996020
- Produktnummer: 37895838
- Verlag: Elsevier - Health Sciences Division
- Sprache: Englisch
- Erscheinungsjahr: 2022
- Seitenangabe: 292 S.
- Masse: H23.5 cm x B19.1 cm x D0.0 cm 450 g
- Gewicht: 450
- Sonstiges: Professional & Vocational
Über den Autor
Shenglin Ma is Associate Professor in the Department of Mechanical and Electrical Engineering at Xiamen University, China. He received his PhD from Peking University and has also been a guest researcher with the National Key Laboratory of Science and Technology in Micro/Nano Fabrication at Peking University. He has over 50 publications and 20 patents to his name, and his research focuses on TSV based 3D integration technology, MEMS and its applications.
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