James E. (Hrsg.) Morris

Nanopackaging

Nanotechnologies and Electronics Packaging

Buch

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive inks, underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnolog… Mehr

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Produktdetails

ISBN: 978-3-030-07999-4
EAN: 9783030079994
Produktnummer: 32609783
Verlag: Springer International Publishing
Sprache: Englisch
Erscheinungsjahr: 2019
Seitenangabe: 1024 S.
Masse: H23.5 cm x B15.5 cm x D5.4 cm 1'515 g
Auflage: Softcover reprint of the original 2nd ed. 2018
Abbildungen: Paperback
Gewicht: 1515

Über den Autor

James E. Morris is Professor of Electrical & Computer Engineering at Portland State University, Oregon. He has edited or co-authored five books on electronic packaging, and has more on the way.