Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging is the first comprehensive reference to collect and present the most, up-to-date, in-depth, practical and easy-to-use information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials, assemblies, structures and systems. The chapters in these two volumes contain summaries of the state-of-the-art and present new information on recently developed important methods or devices. Furthermore, practical recommendations are offered on how to successfully apply current knowledge and recently developed techno…
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Produktdetails
Weitere Autoren: Lee, Y.C. (Hrsg.) / Wong, C.P. (Hrsg.)
- ISBN: 978-1-4899-7885-1
- EAN: 9781489978851
- Produktnummer: 23923616
- Verlag: Springer Nature EN
- Sprache: Englisch
- Erscheinungsjahr: 2016
- Seitenangabe: 1460 S.
- Masse: 2 Ex.; H25.4 cm x B17.8 cm 2'857 g
- Auflage: Softcover reprint of the original 1st ed. 2007
- Gewicht: 2857
Über den Autor
141286493
3 weitere Werke von Ephraim (Hrsg.) Suhir:
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