Layer Formation and Thermal Performance
Gel Thermal Interfaces and Underfills - Basic Experimental and Modeling Techniques Applied to Contemporary Problems in Electronics Packaging
Revision with unchanged content. Better understanding of thermal interface materials is needed as today's electronic devices pack more power into less space. The first part of this work is an experimental and theoretical study of a gel thermal interface material with micron-sized alumina particles dispersed in a heat-curing silicone resin. Experimental and theoretical techniques are used to optimize the formation of thin layers by squeezing flow, and for relating layer thermal resistance to layer thickness. The feasibility is assessed of predicting layer thermal resistance as a function of the squeezing flow procedure, the measured bulk effec…
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Produktdetails
- ISBN: 978-3-639-43703-4
- EAN: 9783639437034
- Produktnummer: 37774207
- Verlag: AV Akademikerverlag
- Sprache: Englisch
- Erscheinungsjahr: 2012
- Seitenangabe: 292 S.
- Masse: H22.0 cm x B15.0 cm x D1.8 cm 453 g
- Abbildungen: Paperback
- Gewicht: 453
Über den Autor
Drew Davidson's (M.S., Ph.D. Binghamton University) research interests include experimental studies of heat transfer and fluid flow in the packaging of microelectronics. His work has received support from NSF, NIST, and the IEEC at Binghamton University. He is currently a postdoctoral research associate with the CAMM at Binghamton University.
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