Innovation Manufacturing and Engineering Management

Volume is indexed by Thomson Reuters CPCI-S (WoS).The main themes and trends covered by this volume are Manufacturing Technology and Applications and Innovation Engineering Management. Both inward-looking research (core areas of Materials and Manufacturing Technology) and outward-looking research (multi-disciplinary, inter-disciplinary and applications) are reviewed. The work will provide invaluable guidance to those interested in these subjects.Fifty papers from the October 2011 conference propose new approaches to manufacturing processes, scheduling, logistics, cost management, data processing, and port construction. Three papers from Chongqing City Management College explore a suitable temperature for lead-free soldering, analyze common defects in reflow soldering on surface mounted electronic components, and optimize wave soldering parameters. Other topics include a seed-fertilizer box for a no-till seeder, an anti-reflective coating for solar cells, an anti-radiation notebook computer, a rating system for green construction, and forecast sharing between a manufacturer and its retailers.