Influence of Temperature on Microelectronics and System Reliability

This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The book provides the reader a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. Covers damage mechanisms, approximately in the temperature range of -55 (degree) C to 150 (degree) C. Presents the effect of temperature in the context of microelectronics reliability. TOC:Does the Cooling of Electronics Increase Reliability? * Temperature Dependence of Microelectronic Package Failure Mechanisms * Temperature Dependence of Microelectronic Package Failure Mechanisms * Electrical Parameter Variations in Bipolar Devices * Electrical Parameter Variations in Mosfet Devices * A Physics-of-Failure Approach to IC Burn-In * Derating Guidelines for Temperature-Tolerant Design of Microelectronic Devices * Derating Guidelines for Temperature-Tolerant Design of Electronic Packages * A Guide for Steady State Temperature Effects *