Harsh Environment Electronics
Interconnect Materials and Performance Assessment
Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditionsThis book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines t…
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Produktdetails
- ISBN: 978-3-527-34419-2
- EAN: 9783527344192
- Produktnummer: 29123630
- Verlag: Wiley-VCH
- Sprache: Englisch
- Erscheinungsjahr: 2019
- Seitenangabe: 400 S.
- Masse: H24.4 cm x B17.0 cm
- Abbildungen: s/w. Tab.
Über den Autor
Ahmed Sharif, PhD, has been working as faculty in the Department of Materials and Metallurgical Engineering at the Bangladesh University of Engineering and Technology since 1999. He is an international renowned scientist in joining technology, and has published more than fifty peer-reviewed papers in leading international journals in soldering and ferroelectric materials research. A part of his PhD research has led to the award of an international prize the IEEE CPMT Young Scientist Award for his paper presentation in an IEEE conference held in Japan in 2004.
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