Guidebook for Managing Silicon Chip Reliability
This is an excellent text detailing situations the professional will encounter in practice. The book: * Includes an extensive table detailing the types of mechanism failures, such as self-heating and hot carrier aging. * Examines deep sub-micron challenges, such as power dissipation, switching noise, and cross talk * Outlines how to establish the specifications defining chip performance, cost, quality, and reliability. * Concentrates on device failure and causes throughout the text - showing how to model the mechanism, test for defects, and avoid and manage damange. * Presents information on evolving IC technologies. TOC:Introduction.- How De…
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Produktdetails
Weitere Autoren: Radojcic, Riko / Rao, Gopal
- ISBN: 978-0-8493-9624-3
- EAN: 9780849396243
- Produktnummer: 23200010
- Verlag: Taylor and Francis
- Sprache: Englisch
- Erscheinungsjahr: 1998
- Seitenangabe: 224 S.
- Masse: H23.4 cm x B15.6 cm 489 g
- Abbildungen: Farb., s/w. Abb.
- Gewicht: 489
Über den Autor
Pecht, Michael; Radojcic, Riko; Rao, Gopal
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