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Cher Ming Tan

Graphene and ULSI Interconnects

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Produktdetails


Weitere Autoren: Narula, Udit / Sangwan, Vivek
  • ISBN: 978-981-48778-2-4
  • EAN: 9789814877824
  • Produktnummer: 36523003
  • Verlag: Taylor and Francis
  • Sprache: Englisch
  • Erscheinungsjahr: 2021
  • Seitenangabe: 250 S.
  • Masse: H22.9 cm x B15.2 cm
  • Abbildungen: Farb., s/w. Abb.

Über den Autor


Cher Ming Tan is director of the Center for Reliability Sciences and Technologies (CReST) and a professor at the Department of Electronic Engineering as well as the Institute of Radiation Research, College of Medicine, Chang Gung University, Taoyuan, Taiwan. He is an honorary chair professor at the Center of Reliability Engineering, Ming Chi University of Technology, Taiwan, and a researcher at the Department of Urology, Chang Gung Memorial Hospital, Taoyuan, Taiwan. He earned his PhD (1992) in electrical engineering from the University of Toronto, Ontario, Canada. He joined Nanyang Technological University, Singapore, as a faculty member in 1997, and Chang Gung University in 2014. His research interests include materials analysis, failure analysis, reliability of electronics devices, reliability of system, reliability statistics, modeling, and simulation.Udit Narula is a postdoctoral research fellow at CReST. He completed his BTech (2011) from Maharshi Dayanand University, Haryana, India, and MTech (2013) from Amity University, Noida, India. He earned his PhD from the Department of Electronic Engineering, Chang Gung University. His research interests include graphene-based ULSI interconnects, graphene synthesis methods, and component/system reliability analysis and statistics.Vivek Sangwan is a postdoctoral research fellow at CReST. He completed his BTech (2012) from Dr. A.P.J. Abdul Kalam Technical University, Lucknow, India and MTech (2014) from Amity University, Noida, India. He earned his PhD (2019) from the Department of Electronic Engineering, Chang Gung University. His research interests include failure and reliability analysis of integrated circuits, design of experiments, and design and simulation of 3D models.

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