Force Sensors for Microelectronic Packaging Applications
This monograph is intended for wire bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors. New measurement technologies are introduced that allow in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here enables measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant f…
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Produktdetails
Weitere Autoren: Mayer, Michael / Brand, Oliver
- ISBN: 978-3-540-22187-6
- EAN: 9783540221876
- Produktnummer: 31958622
- Verlag: Springer Nature EN
- Sprache: Englisch
- Erscheinungsjahr: 2004
- Seitenangabe: 178 S.
- Masse: H23.5 cm x B15.5 cm 980 g
- Gewicht: 980
- Sonstiges: Research
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