Encapsulation Technologies for Electronic Applications
Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contamination, heat, radiation and mechanical stresses are all highly detrimental to electronic devices and can lead to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environments, as well as to provide handling, assembly, electrical and thermal considerations. Currently, more than 99% of…
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Produktdetails
Weitere Autoren: Pecht, Michael G.
- ISBN: 978-0-8155-1970-6
- EAN: 9780815519706
- Produktnummer: 35981283
- Verlag: Elsevier Science & Techn.
- Sprache: Englisch
- Erscheinungsjahr: 2009
- Seitenangabe: 504 S.
- Plattform: EPUB
Über den Autor
Dr. Haleh Ardebili has a BS honors degree in Engineering Science and Mechanics from Pennsylvania State University at University Park, MS degree in Mechanical Engineering from Johns Hopkins University and PhD degree in Mechanical Engineering from University of Maryland at College Park. She has three years of industry experience as research scientist at General Electric Global Research Center at Niskayuna, New York. She is a recipient of GE Invention Fulcrum of Progress Award. She has several years of experience teaching engineering courses at University of Houston. In Sep 2010, she joined as Assistant Professor in the Mechanical Engineering Department at University of Houston. Her research work is mainly focused on nanomaterials for Energy Storage and Electronics.
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