Electroless Copper and Nickel-Phosphorus Plating
Processing, Characterisation and Modelling
Unlike electroplating, electroless plating allows uniform deposits of coating materials over all surfaces, regardless of size, shape and electrical conductivity. Electroless copper and nickel-phosphorus deposits provide protective and functional coatings in industries as diverse as electronics, automotive, aerospace and chemical engineering. This book discusses the latest research in electroless depositions.After an introductory chapter, part one focuses on electroless copper depositions reviewing such areas as surface morphology and residual stress, modelling surface structure, adhesion strength of electroless copper deposit, electrical resi…
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Produktdetails
Weitere Autoren: Wu, Xiaomin / Keong, K G
- ISBN: 978-0-85709-096-6
- EAN: 9780857090966
- Produktnummer: 35980967
- Verlag: Elsevier Science & Techn.
- Sprache: Englisch
- Erscheinungsjahr: 2011
- Seitenangabe: 304 S.
- Plattform: EPUB
Über den Autor
Professor Wei Sha is Professor of Materials Science at The Queen's University of Belfast, UK
4 weitere Werke von W. Sha:
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